Representative Specifications
- Micro Parts, Dimension Tolerance, TGV Pitch, Aspect Ratio, Wafer Diameter
Micro Parts & TGV / Wafer Substrates
Micron-scale glass parts and through-glass-via substrates that bridge optics and electronics. Precision dicing, drilling, and metallization for MEMS, photonics integration, and wafer-level optics.
Applications
- MEMS Packaging
- Photonics Integration
- WLO
Custom Project
Need a Custom Optical Coatings Solution?
Share your target specifications, quantity and timeline. Our team will review the most suitable development and production route.